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01.10.15 13:18

SPLC 2016 Call for Papers

The Systems and Software Product Line Conference (SPLC) is a premier forum where researchers, practitioners, and educators can present and discuss the most recent ideas, trends, experiences, and challenges in the area of software and system product lines engineering. The 20th SPLC will take place in Beijing, China, September 19-23, 2016. For the research track, we invite high quality submissions describing original and unpublished results of in all areas related to software product line engineering

Call for Papers: Link

Important Dates

Abstract Submission: Feb. 22, 2016
Paper Submission: Feb. 29, 2016
Notification of Acceptance: April 25, 2016
Camera-ready Paper Due: May 23, 2016
Conference: Sept. 19-23, 2016


letzte Änderung: 16.10.2015